Company Profile

PEPI (Power Electronic Products International) has been appointed distributors and agents for Mitsubishi, Powerpex, GE, Semitronics, Jinglif, Sic Safco Capacitors.

Product Detail

5th Generation CSTBT ™ IGBT Modules / A-Series		5th Generation CSTBT ™ IGBT Modules / NF-Series
	Combining 5th Generation CSTBT ™ (Carrier Stored Trench Gate Bipolar Transistor) chip technology with LPT (Light Punch-through) wafer.		Showing one rank higher performance compared to competition
High Frequency IGBT Modules / NFH-Series		New NFM-Series
	Optimised for high frequency switching at 50 kHz.		Dedocated Design for High switching frequency resonant inverter power supply makes more suitable specially for Medical and Welding applications
4th Generation Trench IGBT Modules / F-Series		5th Generation CSTBT ™ IPMs / L-Series
	Innovative Mitsubishi U package technology for a full optimisation of the chip performance.		5th Generation IGBT chip with CSTBT ™ technology and 1µm design rule process.

Product News

AS-IPM-Series (Application Specific Intelligent Power Modules   Wednesday, October 25, 2006

Low Loss 3-Phase IGBT Inverter more

1200V DIP-IPM (Dual-in-line Package Intelligent Power Modules)   Wednesday, October 25, 2006

Designed for low power motor control more

4th Generation DIP-IPM (Dual-in-line Intelligent Power Modules)   Wednesday, October 25, 2006

Designed for three phase DC/AC power conversion more

3rd Generation DIP and Mini-DIP-IPM (Dual-in-line Package Intelligent Power Modules)   Wednesday, October 25, 2006

Employing 5th Generation planar IGBT chips with 0.6µm design rule or CSTBT™ technology with superior loss performance more

Power Factor Correction (PFC) DIP-IPM (Dual-in-line Package Intelligent Power Modules)   Wednesday, October 25, 2006

Employing low loss & fast speed IGBTs for total reduction at high frequencies. more

DIP-CIB (Dual-in-line Package Converter-Inverter-Brake)   Wednesday, October 25, 2006

Converter, inverter and brake IGBTs in one space efficient transfer mold housing well respecting UL creepage and clearance distances. more

MOSFET Modules   Wednesday, October 25, 2006

Avalanche capability is guaranteed at turn-off & recovery. more

High Voltage IGBT Modules (HV-IGBT)   Wednesday, October 25, 2006

Improvement of power cycling capability. more

High Voltage Diode Modules   Wednesday, October 25, 2006

Complementary to HV-IGBT modules for multilevel inverter designs. more

High Voltage Intelligent Power Modules (HV-IPM)   Wednesday, October 25, 2006

Highest Reliability in Material and Processes. more

High Voltage Integrated Circuits (HVIC)   Wednesday, October 25, 2006

This product is a semiconductor integrated circuit designed to directly drive the power MOS/IGBT modules of half bridge composition by integrating the 1200V, 600V and 8/24V... more

Transistor Arrays   Wednesday, October 25, 2006

The transistor array is a monolithic IC that contains 4 to 8 transistor circuits and is available in through-hole DIP or surface-mount packages. more

5th Generation Intelligent Power Module (IPM) for Photovoltaic Appliation   Tuesday, October 24, 2006

5th Generaton tench chip (CSTBT™) for lower saturation voltage. more

4th Generation Intelligent Power Module (IPM) / S-Dash-Series   Tuesday, October 24, 2006

Using new 4th Generation planar IGBT chip structure and 1µm design rule. more

3rd Generation Intelligent Power Module (IPM) / S-Series   Tuesday, October 24, 2006

Low losses at high frequencies due to 3rd Generation IGBT chips more

3rd Generation Intelligent Power Modules (IPMs) / V-Series   Tuesday, October 24, 2006

nternal inductance reduced by 50% more

(If this profile looks odd, please let us know.)